Is it possible to cut thicker materials by moving the focal point below the surface of the material being cut? From what I've read, it sounds like the focal point is typically on the surface of the material being cut. So I would assume that the limitations on the thickness of material that can be cut depends on how quickly the beam diverges after passing the focal point. However, wouldn't the beam be symmetrical, diverging the same amount both above and below the focal point?
So if I can cut 1/4" wood focusing on the surface, would I perhaps be able to cut 1/2" by placing the focal point at 1/4" into the material? Since the beam is strong enough to still cut the material 1/4" below the focal point, it would seem that beam would be strong enough to cut the material 1/4" above the focal point.
I'm really hoping to be able to cut 1/2" MDF but my laser is only 35w.
Thanks,
Dave